TSMC targets 100,000 monthly 2nm wafers by 2026, fueled by AI demand

Taiwan Semiconductor Manufacturing Company (TSMC) is accelerating the development of its 2nm manufacturing process. The company targets a production capacity of 100,000 wafers per month. It expects to reach this milestone by the end of 2026. Surging demand from Nvidia, AMD, and Broadcom for high-efficiency data center chips drives the expansion. TSMC is also pulling forward production targets for its current 3nm process to meet sustained market interest. This acceleration secures manufacturing capacity for future hardware from Apple, Qualcomm, and MediaTek. The move solidifies TSMC's technological lead as the AI sector competes for cutting-edge production nodes. TSMC's 2nm process (N2) uses GAA/Nanosheet transistor architecture, with mass production started in H2 2025. The acceleration to 100,000 wafers per month by end of 2026 is driven by AI demand from major customers including Apple (iPhone 19 Pro / A20), NVIDIA Rubin, AMD Zen 6 / RDNA 5, Qualcomm, and Broadcom. The 2nm node continues to ramp rapidly to support next-generation HPC and mobile applications, and customers are already planning investments to support the development of the 1.4nm node.