TSMC 3nm Capacity Expansion Accelerates: Q4 Target 180K Wafers Per Month

According to Wedbush analysis, TSMC's 3nm process capacity is expanding 2-3 months ahead of schedule, with Q4 2026 monthly wafer starts expected to reach 180,000 wafers. Strong orders from NVIDIA, AMD, and Broadcom are driving the expansion. The accelerated ramp reflects surging AI chip demand for advanced nodes. TSMC is also expanding Arizona operations to $265 billion with four fabs, including dedicated CoWoS advanced packaging capacity critical for AI accelerators.