TSMC Develops EMIB-Like Packaging with Kinsus to Counter Intel's CoWoS Threat

TSMC is developing an advanced packaging technology similar to Intel's EMIB (Embedded Multi-die Interconnect Bridge) to prevent customers from shifting from CoWoS to Intel's packaging platform. Amid persistent CoWoS capacity constraints and high demand, TSMC is collaborating with Taiwan-based IC substrate manufacturer Kinsus to advance this EMIB-like solution, which is expected to simplify manufacturing steps, shorten production cycles, and reduce packaging costs. Intel's EMIB embeds a silicon bridge directly into the package substrate, providing local high-density die-to-die interconnects while avoiding the cost and area overhead of full-size silicon interposers. Intel has introduced EMIB-M with integrated MIM capacitors and EMIB-T with TSVs, supporting high-bandwidth connections between logic and HBM, with EMIB-T's TSV enabling vertical interconnects critical for HBM3 stacking. Reports suggest Google may adopt Intel EMIB for its ninth-generation TPU, highlighting the appeal of Intel's packaging technology. Intel's CEO stated that demand for EMIB-T is very high with a growing backlog, targeting high-volume production by 2027. This underscores advanced packaging as a new battleground in AI chip competition, forcing TSMC to quickly respond to maintain its foundry leadership.