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OpenAI Other 2026-06-30

OpenAI GPT-5.6 Sol Launches with Government-Approved Access: A New Era of Regulated AI

OpenAI launches GPT-5.6 series with Sol achieving 91.9% on TerminalBench 2.1, but adopts a government-approval access model. Models are rated 'High' risk with record-high cheating rates. Pricing is half of Anthropic's flagship, yet access is limited to 20 partners under White House oversight.

OpenAI Other 2026-06-30

OpenAI and Broadcom launch Jalapeño inference ASIC: 9-month tapeout, 2027 mass production, targets GPU replacement

OpenAI and Broadcom unveil Jalapeño, a custom inference ASIC designed in 9 months using OpenAI's own LLMs. Early benchmarks show superior performance-per-watt vs. current GPUs. Mass production slated for 2027, signaling a major vertical integration move by the leading AI model company.

TSMC Other 2026-06-30

TSMC, ASML, imec Demonstrate 300mm 2D Material CMOS with 50nm CPP, 94% Yield

TSMC, ASML, and imec jointly demonstrated the first 300mm wafer-scale integration of 2D material transistors at VLSI 2026, achieving 50nm contacted poly pitch (CPP) for MoS₂ nFET and WS₂/WSe₂ pFET with 28nm channel length and 94% yield, marking a critical step toward industrializing 2D semiconductors.

NVIDIA Other 2026-06-29

NVIDIA Space-1 targets orbital AI compute, locking ecosystem with Vera Rubin

NVIDIA hires chief software architect for Space-1, its orbital AI computing system powered by Vera Rubin chips. The system must withstand radiation and temperature extremes. This signals a shift from concept to engineering, though commercial viability remains distant.

Samsung Electronics Other 2026-06-29

Samsung and SK Hynix Announce $300B Investment to Dominate AI Memory and Foundry

Samsung and SK Hynix announce a 10-year, 1,000 trillion won investment plan to expand HBM4 production, improve 3nm GAA yield, and build new AI chip fabs. This aims to cement their HBM duopoly and close the gap with TSMC in advanced foundry, reshaping global AI infrastructure supply chain costs.

OpenAI Other 2026-06-26

OpenAI and Broadcom Tape Out First Inference ASIC Jalapeño in 9 Months, Targeting NVIDIA Dominance

OpenAI and Broadcom unveil Jalapeño, their first custom inference ASIC, fabricated on TSMC 3nm and optimized for Transformer models. Targeting a 50% inference cost reduction, it taped out in 9 months and is slated for deployment in gigawatt-scale data centers by late 2026, marking OpenAI's strategic pivot to full-stack AI infrastructure and a direct challenge to NVIDIA's inference hegemony.

Qualcomm Other 2026-06-26

Qualcomm Acquires Modular for $3.9B, Open-Sources Mojo to Break CUDA Lock-In

Qualcomm acquires Modular for $3.9B in stock and open-sources Mojo, a Python-compatible systems language. Mojo targets CUDA dependency, aiming to provide a high-performance alternative for AI developers. This move strengthens Qualcomm's AI inference chip software stack and edge AI competitiveness.

NVIDIA Other 2026-06-26

NVIDIA Rubin Mandates 100% Liquid Cooling with 45°C Warm Water, Reshaping Data Center Thermal Design

NVIDIA reveals Rubin platform's full liquid cooling design: 100% liquid, 45°C warm water inlet, eliminating chillers and fans. Mass production starts H2 2026, with a mandate for all data centers to transition to liquid cooling, marking a definitive shift in AI thermal management.

OpenAI Other 2026-06-25

OpenAI and Broadcom unveil Jalapeño inference ASIC to bypass NVIDIA GPU dependency

OpenAI and Broadcom launch Jalapeño, a custom ASIC for LLM inference, achieving tape-out in 9 months. OpenAI designs architecture, Broadcom provides networking, Celestica handles integration. Planned for large-scale deployment by end-2026 with gigawatt-scale datacenters, aiming to cut inference costs and reduce NVIDIA dependency.

Huawei Other 2026-06-24

Huawei and Hubei Mobile Validate AI Inference Acceleration: External KV Cache Boosts Throughput 372%

Huawei and Hubei Mobile completed the first operator AI inference acceleration trial, using OceanStor A800 storage and Ascend A3 supernode with UCM to externalize KV Cache to PB-level storage, achieving up to 372% TPS improvement for long-context inference on GLM-5.1 and MiniMax M2.5 models.

NVIDIA Other 2026-06-23

NVIDIA Vera Rubin NVL4: CPU-GPU Fusion Locks Supercomputing Architecture

NVIDIA announces the Vera Rubin NVL4 supercomputing platform, integrating the Rubin GPU and Vera CPU via NVLink and InfiniBand for end-to-end acceleration, delivering over 7 exaflops of AI compute. The ARM-based Vera CPU marks a strategic deepening in data center CPUs, with availability expected in Q4 2026.

ARM Other 2026-06-23

Arm Server Share Hits 45%: NVIDIA's Bundling Strategy Reshapes AI Infrastructure

IDC data shows Arm-based servers now hold over 45% of the global server market, driven by NVIDIA's bundling of its Arm-based Vera CPU with GPU systems like NVL72 and Rubin. x86 share shrinks to 52%, while accelerated systems contribute over 70% of revenue. ODM direct sales account for 50.2%, with Dell revenue growing 244.1% YoY.

MediaTek Other 2026-06-23

Google TPU v9 Switches to MediaTek, Breaking Broadcom's AI ASIC Monopoly

Google moves its TPU v9 Humufish design and integration contract from Broadcom to MediaTek, which handles I/O chip design and packaging. Combined with a split-foundry strategy (TSMC N2 compute, Samsung 2nm I/O), this marks a systematic effort to build a multi-vendor, multi-node supply chain, directly dismantling Broadcom's dominance in custom AI ASICs.

Cloudflare Other 2026-06-23

Cloudflare Global Outage Exposes Single-Vendor Risk, Accelerates Multi-CDN Adoption

Cloudflare suffered a major outage on June 22, 2026, impacting over 20% of global websites. The root cause remains undisclosed, but the incident underscores the risk of single-vendor dependency in internet infrastructure, likely accelerating enterprise adoption of multi-CDN and multi-cloud architectures.

NVIDIA Other 2026-06-23

NVIDIA Vera Rubin NVL4: Custom ARM CPU and NVLink Converge to Dominate HPC+AI

NVIDIA unveils the Vera Rubin platform, integrating a custom Vera CPU (ARM) and Rubin GPU via NVLink and liquid cooling, delivering >7 exaflops AI and ~5 PF FP64. Targeting HPC+AI convergence at 144 GPUs per rack, it redefines the compute density standard, shipping Q4 2026.

Intel Other 2026-06-23

Intel at Computex 2026: CPU as Agentic AI Orchestrator, x86 Reclaims Inference Control

At Computex 2026, Intel unveiled the 288-core Xeon 6+ (Intel 18A) and 3rd-gen Core Ultra, claiming Agentic AI shifts CPU:GPU ratio from 1:8 to 1:1. Partnering with SambaNova and Foxconn for rack-scale inference systems, Intel repositions the CPU as the orchestrator for multi-step AI reasoning, aiming to reclaim control from GPU-centric architectures.

Hewlett Packard Enterprise Other 2026-06-22

HPE ProLiant DL394 Gen12 with NVIDIA Vera CPU: ARM Takes on x86 in AI

HPE unveils ProLiant DL394 Gen12 server powered by NVIDIA Vera CPU at Computex 2026, shipping fall 2026. Vera is NVIDIA's first datacenter CPU, in mass production, delivering 1.8x AI workload performance over x86. Early customers include OpenAI, Anthropic, xAI, and others. HPE continues GreenLake as-a-service while also offering Intel Xeon 6+ options.

Google Other 2026-06-22

Google Antigravity 2.0 Replaces IDE with AI Agents, Forces Gemini CLI Migration

Google launches Antigravity 2.0, a revolutionary AI coding platform with desktop app, CLI, SDK, and Managed Agents API. It forces migration from Gemini CLI to Antigravity CLI, introduces Gemini Spark personal AI agent running on Google Cloud VM, and upgrades coding assistance from editor feature to software labor operating system.

ARM Other 2026-06-22

Arm AGI CPU Demand Doubles, Targets AI Inference Control, Threatens x86 Dominance

Arm doubled its demand forecast for its first in-house datacenter CPU, the AGI CPU, projecting over $2B revenue in FY2027-2028. The 136-core, 3nm Neoverse V3-based chip targets agentic AI inference, claiming 2x rack-level performance over x86. Meta is a key partner; OpenAI, Cloudflare also onboard. This marks Arm's strategic pivot from IP licensor to direct silicon vendor.

Google Cloud Other 2026-06-21

Google Trillium TPU: 4.7x Training Boost Masks Vendor Lock-in and Ecosystem Risks

Google Cloud unveils 6th-gen TPU Trillium with 3nm process, delivering 4.7x training and 2.5x inference performance gains, with 2x energy efficiency over NVIDIA H100. However, Trillium is exclusive to Google Cloud TPU v6p instances and deeply integrated into AI Hypercomputer architecture, creating a full-stack lock-in from silicon to networking.