Reports
AI-generated structured vendor updates
Intel Holds Near $82; Foundry Unit Losses Offset AI-Driven Recovery
...
TSMC 2nm Volume Production Begins, AMD First to Launch Venice and MI455X
TSMC has fully ramped its 2nm process at five fabs, contributing ~3% of wafer revenue in Q2. AMD launches the first 2nm-based products: EPYC Venice (256 cores) and Instinct MI455X (320B transistors, 432GB HBM4), shipping in Q3. Samsung targets 1.4nm by 2029, Intel 18A introduces High-NA EUV, intensifying foundry competition.
Intel Accelerates 14A to 2027H2 Risk Production, 18A Yield Exceeds Target by 25%, Capex Raised to $20B
Intel announced 14A process acceleration to risk production in 2027H2 with HVM in 2028, 18A yield exceeding target by 25% supporting Panther Lake volume, and raising 2026 capex to $20B, signaling an aggressive foundry push. Advanced packaging EMIB-T becomes a profit pillar.
Intel 18A Yield Hits 85%, Secures Orders from NVIDIA, OpenAI, Reshaping Foundry Landscape
Intel reports 18A process yield improvement to 85%, from 65% last quarter, nearing TSMC N2's 90%. Secured foundry deals with NVIDIA, AMD, OpenAI, etc. EMIB advanced packaging yield reaches 98%, used in NVIDIA Feynman, Google TPU. This marks a strategic inflection in AI chip manufacturing.
Meta Shifts MTIA ASIC to Samsung 2nm: Ecosystem Restructuring in AI Chip Fab
Meta partners with Samsung for next-gen MTIA ASIC production, moving from TSMC to Samsung 2nm node. Targeting hundreds of thousands of units to support 5GW data center goal by 2030, with new chip every six months, restructuring the AI chip supply chain ecosystem.
Samsung Restarts 1.4nm Foundry Node, Pre-emptively Locks Equipment Supply Chain
Samsung Electronics restarts 1.4nm (SF1.4) process commercialization, ordering equipment vendors to develop tools early. The node will use High-NA EUV lithography and GAA transistors, fabbed at NRD-K campus. This move aims to catch up with TSMC and Intel, but mass production timeline remains undisclosed.
Samsung Re-accelerates 1.4nm Node R&D, Adopts High-NA EUV Lithography
Samsung Electronics is re-accelerating its 1.4nm (SF1.4) process node R&D, targeting mass production by 2028-2029. It has procured High-NA EUV lithography equipment from ASML for its NRD-K R&D complex and ordered tools for 12th-gen V-NAND with wafer stacking. The move aims to catch up with TSMC and Intel in the AI chip foundry race.
TSMC, ASML, imec Demonstrate 300mm 2D Material CMOS with 50nm CPP, 94% Yield
TSMC, ASML, and imec jointly demonstrated the first 300mm wafer-scale integration of 2D material transistors at VLSI 2026, achieving 50nm contacted poly pitch (CPP) for MoS₂ nFET and WS₂/WSe₂ pFET with 28nm channel length and 94% yield, marking a critical step toward industrializing 2D semiconductors.
TSMC Capacity Crunch Reshapes Foundry Landscape: Google, AMD, Tesla Move to Samsung for Advanced Nodes
TSMC's advanced capacity shortage through 2027 pushes Google, AMD, and Tesla to Samsung for 3nm/2nm foundry services. Samsung's 6.5% market share may see structural growth, shifting global chip supply from single-source to multi-source, though yield and trust issues persist.
Intel to Build xAI Terafab AI Chip Factory
Intel announced helping build Elon Musk Terafab AI chip factory, marking key customer breakthrough for Intel Foundry. AI chip manufacturing demand grows, foundry competition accelerates.
TSMC Launches Mask Service to Strengthen One-Stop Chip Manufacturing
TSMC officially launches mask manufacturing service covering full process from data preparation to inspection and repair. The service integrates mask fabrication capabilities for process co-optimization and faster time-to-market. This strengthens TSMC's one-stop manufacturing solution and deepens customer collaboration.
TSMC Launches Manufacturing Optimization with Data Analytics and Machine Learning
TSMC introduces an engineering optimization solution integrating data analytics and ML for real-time monitoring and intelligent analysis of manufacturing processes, proactively identifying anomalies to improve wafer yield. The solution focuses on systematic optimization of process parameters and equipment efficiency.