Samsung Unveils 400-Layer AI Memory; Shares Rise 2%

Samsung Electronics has taken a significant step in the artificial intelligence hardware market by unveiling its new V10 BV-NAND memory technology. The company showcased the prototype, which features more than 400 layers and a unique wafer-bonding design, at the Future of Memory and Storage conference in Santa Clara. Following the announcement, Samsung shares rose over 2% on August 5, 2026, reflecting positive market sentiment amid a broader rally in chip stocks. The new BV-NAND technology is built to handle the heavy data requirements of modern AI systems. By using advanced wafer-bonding, the technology increases memory storage density by approximately 58% compared to the previous V9 version. This allows AI systems to process and generate data faster and more efficiently. In addition to the new NAND chips, the company also presented concept models for zHBM and zNAND-O architectures. These designs change the traditional layout by vertically stacking memory directly above AI processors, which shortens the distance data needs to travel and helps save energy. For the second quarter of 2026, the company posted a massive operating profit of KRW 89.5 trillion on revenue of KRW 171.5 trillion, representing a significant year-over-year improvement. The operating margin reached 52.2%, highlighting the profitability of high-end memory products used in AI infrastructure. Samsung is shifting its strategy toward long-term agreements, aiming for multi-year customer deals to eventually account for 60% to 70% of its memory sales.