Reports
AI-generated structured vendor updates
TSMC, ASML, imec Demonstrate 300mm 2D Material CMOS with 50nm CPP, 94% Yield
TSMC, ASML, and imec jointly demonstrated the first 300mm wafer-scale integration of 2D material transistors at VLSI 2026, achieving 50nm contacted poly pitch (CPP) for MoS₂ nFET and WS₂/WSe₂ pFET with 28nm channel length and 94% yield, marking a critical step toward industrializing 2D semiconductors.
ASML and imec Deepen Strategic Partnership to Strengthen European Semiconductor R&D and Sustainable Innovation Foundation
ASML and the Belgian research center imec have signed a new strategic partnership agreement to accelerate next-generation semiconductor technology R&D, with a specific focus on sustainable innovation. The collaboration will deepen joint research in key areas such as high-NA EUV lithography, advanced packaging, and materials science, supporting the long-term competitiveness of the European semiconductor ecosystem.