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Amazon Other 2026-08-13

亚马逊AWS扩展Trainium和Inferentia AI芯片部署,与Cerebras合作加速推理

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MediaTek Other 2026-08-12

MediaTek Targets Google TPU and Meta AI ASICs with 2nm 400G SerDes

MediaTek is advancing 400G SerDes IP on 2nm to enter data center high-speed interconnects, targeting Google TPU v10 and Meta AI ASIC orders. It also launched Genio 420 for edge AI and deployed Alibaba's Qwen LLM on Dimensity devices, expanding from cloud to edge AI chips.

Amazon Other 2026-08-07

AWS EC2 G7实例上线欧洲 支持AI工作负载

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AMD Other 2026-08-07

AMD收购AI推理芯片公司Taalas 补强AI推理路线图

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Huawei Other 2026-08-06

华为6大新品及尊界MPV 8月5日集体登场 余承东:阵容强大

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CrowdStrike Other 2026-07-29

CrowdStrike Partners Cerebras for Sub-Millisecond AI Security Inference

CrowdStrike and Cerebras announce strategic partnership integrating Falcon AIDR with Cerebras wafer-scale inference for sub-millisecond threat detection. Cerebras also deploys CrowdStrike to secure its AI infrastructure. This marks a shift from GPU to dedicated wafer-scale chips for security AI.

Apple Other 2026-07-28

苹果M7芯片跳过M6代际直指端侧AI推理加速

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NVIDIA Other 2026-07-28

NVIDIA通知合作伙伴GPU套件全线涨价

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AMD Other 2026-07-25

AMD and Cerebras Unveil Disaggregated AI Inference with Wafer-Scale Engine

AMD and Cerebras launch a disaggregated AI inference solution combining the Helios Rackscale system (6th-gen EPYC Venice CPUs + up to 72 Instinct MI455X GPUs) with the Cerebras WSE-3 (4 trillion transistors) via Infinity Fabric, targeting ultra-low latency and high throughput for AI inference, challenging traditional GPU clusters.

AMD Other 2026-07-23

Microsoft Azure Deploys AMD Helios Rack with MI455X GPUs, Launches Three New VM Families

Microsoft Azure announces the deployment of AMD Helios rack-scale AI platform, featuring 72 Instinct MI455X GPUs, 31TB HBM4 memory, and 1.4PB/s bandwidth per rack. Three new VM families target AI inference, data engineering, and HPC, powered by 6th-gen EPYC Venice CPUs and Pensando DPUs.

Google Other 2026-07-20

Google's Frozen v2 Chip Hardwires Gemini Architecture for 6-10x TPU Efficiency, Set for 2028

Google is developing Frozen v2, a dedicated AI chip that hardwires the Gemini model architecture into silicon for 6-10x energy efficiency per token over current TPUs. It is a new product line, planned for 2028, with weight update flexibility but a frozen architecture. This validates the industry shift from general-purpose GPUs to dedicated ASICs for AI inference.

AMD Other 2026-07-20

Microsoft Azure Deploys AMD Helios Rack with MI455X GPUs, Breaking NVIDIA's Cloud AI Monopoly

Microsoft Azure officially adopts AMD Helios rack-scale AI infrastructure, featuring 72 MI455X GPUs (432GB HBM4, 19.6TB/s), Venice EPYC CPUs, and Pensando DPUs. Three new instances (ND MI455X v7, HDv2, HXv2) are launched, marking Azure's shift from exclusive NVIDIA dependency to a multi-vendor AI strategy.

AMD Other 2026-07-15

AMD Confirms Zen 6 EPYC Venice: First 2nm Server CPU Launching July 2026

AMD confirms Zen 6 EPYC Venice launch at Advancing AI 2026 (July 22-23). As the first 2nm server CPU, it features triple-core hybrid architecture, up to 192 cores, ~29% single-thread and ~22% multi-thread gains, targeting AI inference and tight CPU-GPU synergy via Infinity Fabric.

Intel Other 2026-07-15

Intel Launches Starfire Space-Grade SoC on 18A to Challenge Xilinx Dominance

Intel unveils Starfire, a space-grade SoC built on Intel 18A process with Foveros packaging, derived from Panther Lake. Targeting satellite payloads and on-orbit AI inference, sampling in Q3 2026, it aims to disrupt Xilinx/Microchip's space FPGA ecosystem with advanced AI and SWaP-C optimization.

Samsung Electronics Other 2026-07-10

Samsung GAIA AI PC Chip Samples with Memory-Centric NPU, Targeting 50 TOPS

Samsung launches GAIA AI PC processor with 4nm process and memory-centric NPU, integrating LPDDR5X controller with NPU for near-memory computing, achieving 40% energy efficiency improvement and 50 TOPS. Certified for Microsoft Copilot+ PC, Lenovo to adopt in Q4 2026.

AMD Other 2026-07-10

AMD's Experimental Topological Ghost Protocol Boosts MI300X Inference 10x

AMD introduces experimental Topological Ghost Protocol (TGP) on MI300X GPUs, achieving 431 tokens/sec with 100% success in high-concurrency inference, 10x improvement over standard vLLM. TGP uses KV-cache recycling and segmented state management, still experimental but potentially redefining AI inference benchmarks.

NVIDIA Other 2026-07-09

SambaNova完成11亿美元融资估值110亿美元:推理芯片新格局确立

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MediaTek Other 2026-07-07

MediaTek and Alibaba Cloud Deploy Tongyi Qianwen LLM on Dimensity Chips

MediaTek partners with Alibaba Cloud to deploy a small version of the Tongyi Qianwen LLM on Dimensity 9300/8300 mobile platforms, enabling offline multi-turn conversations. This move aims to capture edge AI inference control via NPU optimization and SDK integration, directly challenging Qualcomm.

Huawei Other 2026-07-06

Huawei Unveils Tao's Law V2: Kirin 2026 Boosts AI Inference 40% on Same Node

Huawei's He Tingbo releases Tao's Law V2, detailing Kirin 2026 metrics: 238 MTr/mm² transistor density (+55%), 41% power reduction at iso-performance, and 40% SRAM frequency increase. Without EUV lithography, co-optimization of architecture, circuit, and process delivers equivalent performance gains, proving system-level optimization as a viable alternative to Moore's Law scaling.

Google Cloud Other 2026-07-06

Google Cloud Launches Blackwell GPU Confidential VM & Open-Source Prompt Encryption SDK, Redefining AI Security

Google Cloud upgrades its confidential computing portfolio with Blackwell GPU-based confidential VMs (Confidential G4 VMs preview), open-source Prompt Encryption SDK, and enhanced Confidential Space featuring Intel Trust Authority and Hopper GPU support, addressing TEE vulnerability CVE-2026-33697 to bolster AI inference and cross-organization training security.