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2026-06-17
Applied Materials Launches Deposition and Etch Systems for 3D Chip Scaling
Applied Materials unveils Centris Spectral SiN ALD for uniform dielectric deposition in GAA contacts and Producer Selectra Mo Etch for molybdenum-based 3D NAND word line separation, addressing high-aspect-ratio uniformity issues critical for AI chip manufacturing.
Samsung Electronics
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2026-05-23
Micron Partners TSMC for Custom HBM4E Logic Dies, Targets 2027 Ramp with 1-gamma DRAM
Micron plans to ramp HBM4E in 2027, transitioning to 1-gamma DRAM and using TSMC for both standard and custom logic dies. This marks a shift from standardized HBM to customized solutions, positioning memory as a strategic asset for AI inference workloads.