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2026-06-17
Applied Materials发布3D芯片工艺新系统，支持GAA晶体管和3D NAND扩展
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Samsung Electronics
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2026-05-23
Micron Partners TSMC for Custom HBM4E Logic Dies, Targets 2027 Ramp with 1-gamma DRAM
Micron plans to ramp HBM4E in 2027, transitioning to 1-gamma DRAM and using TSMC for both standard and custom logic dies. This marks a shift from standardized HBM to customized solutions, positioning memory as a strategic asset for AI inference workloads.