Reports
AI-generated structured vendor updates
TSMC, ASML, imec Demonstrate 300mm 2D Material CMOS with 50nm CPP, 94% Yield
TSMC, ASML, and imec jointly demonstrated the first 300mm wafer-scale integration of 2D material transistors at VLSI 2026, achieving 50nm contacted poly pitch (CPP) for MoS₂ nFET and WS₂/WSe₂ pFET with 28nm channel length and 94% yield, marking a critical step toward industrializing 2D semiconductors.
Google TPU 8th Gen Splits Training and Inference Chips, Inflection Point in AI Infra TCO
Google Cloud unveils 8th-gen TPU with separate training (TPU8t) and inference (TPU8i) chips, delivering 3x training pod performance and 80% inference dollar-performance improvement. Vertex AI evolves into Gemini Enterprise Agent Platform, while the Smals sovereign cloud contract validates public sector AI adoption under strict compliance.
AWS Launches European Sovereign Cloud with Enhanced Data Residency
AWS launched an independent cloud region entirely within the EU, ensuring data sovereignty through physical and logical isolation. Operated exclusively by EU residents with all metadata retained locally, it leverages Nitro system security. Initially offers 90+ services including AI, compute, and security.
ASML and imec Deepen Strategic Partnership to Strengthen European Semiconductor R&D and Sustainable Innovation Foundation
ASML and the Belgian research center imec have signed a new strategic partnership agreement to accelerate next-generation semiconductor technology R&D, with a specific focus on sustainable innovation. The collaboration will deepen joint research in key areas such as high-NA EUV lithography, advanced packaging, and materials science, supporting the long-term competitiveness of the European semiconductor ecosystem.