Reports
AI-generated structured vendor updates
MediaTek Adopts Dual Packaging: CoWoS and Intel EMIB-T for ASIC
MediaTek CEO confirms ASIC projects adopt Intel EMIB-T packaging alongside TSMC CoWoS. EMIB-T uses micro bridges for high-density interconnects, supporting HBM, achieving 8-10x reticle area at lower cost. Dual-track strategy highlights packaging as a key competitive dimension in AI chips.
Palo Alto Networks Launches Prisma AIRS AI Gateway as Enterprise AI Control Plane
Palo Alto Networks announces GA of Prisma AIRS AI Gateway, integrating Portkey technology. It acts as an enterprise AI control plane for LLM, MCP, and A2A interactions, offering observability, governance, and security. Processed 68 trillion tokens with sub-millisecond latency and 99.999% availability.
Cloudflare Migrates cdnjs to Workers Platform, Handling 9 Billion Requests Daily
Cloudflare has fully migrated cdnjs to its developer platform, leveraging R2, KV, Workers, and Workflows. The new architecture handles 9 billion requests daily with a 98.6% cache hit rate, demonstrating the scalability of edge computing for critical CDN infrastructure.
NVIDIA Vera Rubin Goes Global: 10x Token per Megawatt, Locks In AI Factory Standard
NVIDIA announces full production and global delivery of Vera Rubin platform, with CoreWeave and cloud providers deploying NVL72 systems. Featuring Vera CPU and Rubin GPU, the platform delivers 10x token throughput per megawatt over Blackwell, enabling gigawatt-scale AI factories across 350+ sites.
Google Guarantees Anthropic Data Center, Deploys TPUs to Challenge NVIDIA's GPU Dominance
Anthropic is building a $15B AI data center in Texas, backed by Google's financial guarantee in exchange for 20% equity. The facility will deploy Google's TPU chips, co-designed with Broadcom, signaling a shift in AI compute landscape and challenging NVIDIA's GPU dominance.
TSMC Accelerates 1.4nm Process, Partners with Unimicron on EMIB-Like Packaging to Counter Intel
TSMC accelerates its 1.4nm (A14) process to mid-2028 mass production, using second-gen GAA NanoFlex Pro transistors and existing EUV lithography. It also partners with Unimicron on EMIB-like packaging to alleviate CoWoS capacity constraints and prevent AI chip customer loss to Intel's packaging platform.
Qualcomm Acquires Modular: Challenging NVIDIA's CUDA with Mojo Language for Full-Stack AI
Qualcomm completes acquisition of Modular, retaining Mojo language, MAX inference engine, and Modular Cloud. This marks Qualcomm's strategic shift to a full-stack AI platform, directly challenging NVIDIA's CUDA ecosystem and enabling AI deployment from edge to cloud.
NVIDIA Rubin GPU Detailed: 3nm Dual-Die, 336B Transistors, 288GB HBM4, NVLink 6 Doubles Bandwidth
NVIDIA unveiled the full Rubin GPU architecture at SIGGRAPH 2026: 3nm dual-die, 336B transistors, 288GB HBM4 with 22 TB/s bandwidth, and NVLink 6 at 3600 GB/s. The NVL72 rack integrates 72 GPUs with 36 Vera CPUs, requiring full liquid cooling due to >1000W TDP.
Zscaler报告显示企业100%存在未治理AI暴露面
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诺基亚Q2财报超预期 AI-RAN平台驱动光网络营收大涨20%
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爱立信与LG Uplus签署AI原生网络与语音AI战略合作协议
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微软Azure举办AI代理生产环境部署技术加速器
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NVIDIA Vera Rubin NVL72 Enters Production, 10x Energy Efficiency Reshapes AI Infrastructure
NVIDIA has announced full production of the Vera Rubin NVL72 platform, with first shipments to CoreWeave, Microsoft, Amazon, and Oracle. Each rack integrates 72 Rubin GPUs and 36 Vera CPUs, delivering 10x improvement in energy efficiency and inference cost over Blackwell for agentic AI workloads, marking a new era of rack-scale AI infrastructure.
TSMC 2nm Volume Production Begins, AMD First to Launch Venice and MI455X
TSMC has fully ramped its 2nm process at five fabs, contributing ~3% of wafer revenue in Q2. AMD launches the first 2nm-based products: EPYC Venice (256 cores) and Instinct MI455X (320B transistors, 432GB HBM4), shipping in Q3. Samsung targets 1.4nm by 2029, Intel 18A introduces High-NA EUV, intensifying foundry competition.
NVIDIA GPU套装全线涨价涉及GDDR7与GDDR6显存
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Alibaba Cloud Unveils Agent-Native Suite and Open-Source SAIL Stack to Rival CUDA
At WAIC 2026, Alibaba Cloud launched its Agent-Native cloud suite (AgentLoop, AgentTeams, AgentRun, TokenWorks), open-sourced the T-Head SAIL AI software stack, and unveiled the 2.4T-parameter Qwen 3.8-Max-Preview model and Zhenwu M890 supernode, marking a comprehensive push into agent-native cloud and open-source AI ecosystem.
Meta Transforms into AI Compute Landlord with $10B Anthropic Lease Deal
Meta is in early talks with Anthropic for a $10 billion compute lease deal, marking its strategic shift from internal AI infrastructure user to commercial landlord. This move monetizes Meta's massive capex and creates an inter-cloud leasing model, fundamentally reshaping the AI compute supply chain.
NVIDIA and SK Group Lock HBM4 Supply and Launch Sovereign AI Factory Model with $500B+ Deal
NVIDIA and SK Group announced a $500B+ AI partnership including a 2GW AI factory using Vera Rubin and HBM4, long-term HBM4 supply lock, and a $1B NVIDIA investment in Naver (with $9B from Brookfield). Samsung and Broadcom signed a $200B deal. This signals a new era of sovereign AI infrastructure and supply chain deep-locking.
AMD launches world's first 2nm GPU MI455X and Zen 6 EPYC, targets NVIDIA and Intel
At Advancing AI 2026, AMD announced 46% data center CPU market share and launched the world's first 2nm GPU, Instinct MI455X, with CDNA architecture and HBM4 memory. The 6th-gen EPYC Venice (Zen 6) was also unveiled, targeting AI workloads.
Microsoft and Databricks Expand Partnership: Full Azure Migration with Cobalt 200 ARM, Locking AI Agent Control Plane
Databricks will fully migrate to Azure, using Microsoft Cobalt 200 ARM chips for data and AI workloads, with deep integration of Genie and Unity AI Gateway into Microsoft products, locking in long-term partnership. Databricks raises $18.8B valuation.