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Intel押注3D堆叠AI芯片 18A-PT+Foveros Direct 3D+EMIB-T全栈整合
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TSMC Adds Winbond to WoW 3D Stacking Memory Supply, Breaking DRAM Oligopoly
Winbond joins TSMC's Wafer-on-Wafer (WoW) 3D stacking advanced packaging supply chain, becoming a new DRAM wafer supplier alongside Samsung, SK Hynix, and Micron. This move reduces reliance on the three global DRAM giants and strengthens AI chip packaging supply resilience. Winbond provides DRAM wafers for vertical stacking with TSMC logic wafers, offering 8GB capacity and 256GB/s bandwidth via its CUBE solution.
NVIDIA and SK Hynix Lock Down HBM4/5 Roadmap, Cementing Vera Rubin Supply Chain
NVIDIA and SK Hynix sign a multi-year agreement to co-define HBM4 production and HBM5 pre-research for Vera Rubin GPUs. Samsung also enters HBM4 supply as a second source. The deal elevates SK Hynix from vendor to co-developer, potentially creating a de facto memory standard barrier that marginalizes Micron and others.