Filter

×
Active Filters Clear All
Keyword: data center ×
165 Total Reports
2/9 Page
NVIDIA Other 2026-06-23

NVIDIA's AI Agents and Digital Twins Reshape Telecom Network Control Plane

At DTW Ignite 2026, NVIDIA showcases its AI agent platform integrating NeMo synthetic data, NemoClaw secure runtime, OpenShell sandbox, and RTX PRO 6000-accelerated digital twins, aiming for autonomous telecom operations. Partners include SoftBank, Amdocs, NTT DATA, etc., moving from task automation to full autonomy.

ARM Other 2026-06-23

Arm servers capture >45% data center revenue, x86 ecosystem under AI-driven assault

IDC reports Q1 2026 global server revenue hit a record $122.6B, with Arm-based servers capturing >45% share (x86 at 52%). Accelerated servers (GPU/ASIC/FPGA) generated >70% revenue. Nvidia's Grace CPU (NVL72) and hyperscaler custom Arm chips drive the shift; x86 still leads in unit volume but faces supply constraints.

ASML Other 2026-06-23

ASML CEO Validates Musk's Terafab, Reshaping AI Chip Supply Chain

ASML's CEO publicly acknowledges tracking Elon Musk's planned terawatt-scale AI supercomputer Terafab, comparing it to Korean DRAM megaprojects. This signals that the sole EUV lithography supplier is allocating capacity, potentially transforming AI chip supply chain and vertical integration.

NVIDIA Other 2026-06-23

Nvidia Vera Rubin CPU: 10-Wide Core Redefines CPU for Agentic Computing

At GTC Taipei 2026, Nvidia unveiled the Vera Rubin CPU with a custom 10-wide fetch/decode/execute pipeline, claiming world-leading IPC and bandwidth. Designed for agentic computing, it complements Nvidia GPUs. Nvidia also announced a partnership with Microsoft to reinvent the PC as a Personal AI and committed to returning 50% of free cash flow to shareholders.

Anthropic Other 2026-06-22

Micron-Anthropic Deal: Memory Co-Architecture Locks in AI Supply Chain

Micron and Anthropic sign a strategic agreement covering joint memory/storage architecture design, multi-year supply, Claude adoption, and investment. This ties frontier AI model demands directly to infrastructure design, aiming to optimize token economics and power efficiency, but essentially locks in supply and restructures the ecosystem.

NVIDIA Other 2026-06-22

Dell PowerEdge XE8812: Liquid-Cooled Density Trap with NVIDIA Vera Rubin NVL4

Dell launches PowerEdge XE8812 with NVIDIA Vera Rubin NVL4, delivering 144 GPUs per rack, 300kW+ power, and 100% direct liquid cooling. It offers a generational leap in memory and compute density for HPC and AI, but deeply locks users into Dell's PowerRack, iDRAC, and ORv3 ecosystem from chip to rack.

NVIDIA Other 2026-06-22

NVIDIA Rubin 100% Liquid Cooling at 45°C Slashes Cooling Energy 40%

NVIDIA Rubin generation achieves 100% liquid cooling with coolant up to 45°C, eliminating fans and cold aisles. The DSX reference design uses closed-loop dry coolers, reducing cooling energy ~40% and water consumption to near zero. Rack density triples, marking a fundamental shift in AI factory cooling.

Cisco Other 2026-06-18

Cisco Leverages NVIDIA Spectrum Silicon and Nexus One to Reshape AI Network Control Plane

Cisco launches N9100 switches with NVIDIA Spectrum-6/4 silicon, delivering 102.4T throughput. It also introduces Nexus One unified management plane spanning NX-OS and SONiC, and extends Hybrid Mesh Firewall to BlueField DPUs for AI workload security offload, aiming for a turnkey AI fabric control plane.

NVIDIA Other 2026-06-18

NVIDIA's French AI Push: Open Models as a Trojan Horse for Hardware Lock-in

NVIDIA partners with French entities to deploy GB200, Blackwell B300, and Vera Rubin NVL72 systems, while promoting the Nemotron open model coalition. This builds an NVIDIA-centric AI infrastructure ecosystem in Europe, masking hardware lock-in with open model rhetoric.

ASML Other 2026-06-18

ASML CEO's EUV Supply Warning Signals a Physical Ceiling on AI Chip Expansion

ASML CEO Fouquet confirms talks with Musk on Terafab but stresses supply constraints. EUV lithography, the sole tool for advanced AI chips, cannot scale quickly. With TSMC, Samsung, Intel, and Musk all vying for limited machines, AI chip capacity allocation becomes a zero-sum game, capping the entire AI infrastructure buildout.

Hewlett Packard Enterprise Other 2026-06-17

HPE Consolidates Morpheus & GreenLake into Unified Agentic Control Plane for Hybrid Cloud and AI

HPE integrates Morpheus software into GreenLake, delivering a unified agentic orchestration and control plane for AI factories and traditional workloads. GreenLake Intelligence advances agentic AIOps, with partnerships with ServiceNow and Citrix, aiming to reduce virtualization costs and simplify hybrid cloud operations under a single operating model.

Google Cloud Other 2026-06-17

ASUS Launches NVIDIA GB300 Deskside AI Supercomputer, Shifting Control from Cloud to On-Prem

ASUS launches the ExpertCenter Pro ET900N G3, powered by NVIDIA's GB300 Grace Blackwell Ultra Desktop Superchip, delivering 20 PFLOPS and 748GB of coherent memory for near-trillion parameter models. Concurrently, Coherent expands InP fab in Texas for optical interconnects, and NVIDIA plans a $20-25B debt offering, signaling a systemic shift of AI control from cloud to localized enterprise hardware.

NVIDIA Other 2026-06-17

NVIDIA & Coherent Expand 6-Inch InP Fab, Locking AI Optical Interconnect Supply Chain

Coherent breaks ground on the world's first 6-inch indium phosphide fab in Texas, backed by $2B from NVIDIA and multi-billion purchase commitments. The facility produces lasers, transceivers, and pluggable optics for silicon photonics interconnects, enabling NVIDIA's Vera Rubin Ultra NVL576 576-GPU clusters and signaling a mass shift from copper to optical backbones in AI data centers.

NVIDIA Other 2026-06-17

NVIDIA and Coherent Scale 6-Inch InP Fab, Optical Interconnect Becomes AI Infrastructure's New Bottleneck Breaker

NVIDIA invests $2B and commits multi-billion purchases to Coherent's expanded 6-inch indium phosphide fab in Texas, scaling production of lasers and optical modules for AI interconnects. This addresses copper's distance and power limitations in large GPU clusters (e.g., Vera Rubin Ultra NVL576), pushing co-packaged optics into volume manufacturing.

AMD Other 2026-06-17

AMD MLPerf 6.0: MI350 GPUs Achieve 3.5x Leap with MXFP4, Debut Multi-Node Training

AMD submitted its most comprehensive MLPerf Training 6.0 results, including first multi-node training (FLUX.1 on 512 GPUs) and MXFP4 training recipe. MI355X delivers 3.5x generational leap over MI300X on Llama 2-70B, within 5% of NVIDIA B200. 10 ecosystem partners validated reproducibility.

NVIDIA Other 2026-06-16

NVIDIA Blackwell Sweeps MLPerf: NVLink and NVFP4 Redefine AI Training Economics

NVIDIA Blackwell dominates MLPerf Training 6.0, submitting across all seven benchmarks including MoE workloads. GB300 NVL72 delivers up to 1.6x faster training than GB200, with fifth-gen NVLink unifying 72 GPUs as one giant GPU. NVFP4 low-precision training and massive scale (8,192 GPUs) set new industry standards.

Hewlett Packard Enterprise Other 2026-06-16

HPE Expands Self-Driving Networks: AI Control Plane Unifies Juniper & Aruba, Locks Management Stack

HPE integrates Juniper networking into its AI Data Center Solution, expanding self-driving networks across edge, campus, DC, and AI factories. New Mist support for CX switches, Marvis AIOps in Aruba Central, and QFX switches optimized for inferencing. Unified SASE platform aims to simplify operations via agentic AI automation, consolidating control under a single AI management plane.

AMD Other 2026-06-16

AMD and Rackspace Deploy 30MW Governed AI Stack: Ecosystem Restructuring from Silicon to Outcomes

AMD and Rackspace sign a definitive agreement to deploy 30MW of AMD AI compute (Instinct GPUs including MI355X, EPYC CPUs) across Rackspace's data centers, creating a governed enterprise AI stack with single accountability from silicon to outcomes, targeting regulated industries.

Google Other 2026-06-16

Google Open-Sources Brazos: Plug-and-Play Liquid Cooling for Air-Cooled DCs

Google introduces Brazos, a rack-mounted closed-loop liquid-to-air cooling system for existing air-cooled data centers. Supporting 60kW per rack, it is open-sourced via OCP, enabling high-density AI/HPC deployments without facility retrofits.

Cisco Other 2026-06-15

Cisco G300: A Lock-in Play for AI Network Control Plane Dominance

Cisco launches the Silicon One G300 programmable AI networking chip for AI data centers and ML clusters. It extends Cisco's unified routing, switching, and AI acceleration architecture, but fundamentally aims to lock users into a proprietary control plane, countering open ecosystems from Broadcom and Nvidia.