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8 Total Reports
AMD Other 2026-07-26

AMD Helios Enters Production: 12-Stack HBM4 Outmuscles NVIDIA, UALoE Opens AI Network

AMD's second-generation Helios rack-scale AI server enters full production, featuring 72 MI455X GPUs with Samsung's exclusive 12-stack HBM4 (31TB per rack). Compared to NVIDIA's 8-stack design, it offers 50% more memory and 30% lower token cost. Microsoft Azure commits to large-scale deployment, solidifying hyperscaler dual-vendor strategy.

NVIDIA Other 2026-07-25

NVIDIA Prepay $1.5B to Amkor for US 2nm/3nm/HBM4 Advanced Packaging

NVIDIA prepays $1.5B to Amkor to expand advanced packaging capacity in Arizona, covering 2nm/3nm/HBM4. This onshores AI chip packaging, complementing Wistron's system integration, to reduce reliance on Taiwan and secure supply for Vera Rubin and Blackwell Ultra.

NVIDIA Other 2026-07-25

NVIDIA and Wistron Launch US-Based GB300 Production, Shifting AI Manufacturing Landscape

NVIDIA partnered with Wistron to open a $700M factory in Texas, achieving L6 integration of the GB300 Grace Blackwell Ultra system. The first US-made unit contains 1.5M parts, weighs 2 tons, and costs $4M. This milestone accelerates US AI capex localization from 5% to 30%, reshaping the global AI supply chain.

AMD Other 2026-07-23

AMD Unveils Zen 6 Venice, MI455X, and Helios Rack-Level Design to Challenge NVIDIA

At Advancing AI 2026, AMD launched Zen 6 EPYC Venice (2nm, up to 256 cores) and MI455X (CDNA5, 432GB HBM4, 40 PFLOPS FP4), along with Helios rack reference design (2.9 exaFLOPS FP4 per rack), claiming a 1000x AI performance roadmap, with major commitments from Meta, OpenAI, and others.

NVIDIA Other 2026-07-22

NVIDIA and Wistron Open US Factory for GB300 and Vera Rubin AI Superchips

Wistron opens its first US manufacturing facility in Fort Worth, producing NVIDIA GB300 Grace Blackwell Ultra and Vera Rubin superchips. The $700M plant aims for tens of thousands of boards monthly, marking NVIDIA's strategic shift to domestic AI hardware production.

NVIDIA Other 2026-06-25

Qualcomm Dragonfly: 250-core CPU, HBC memory, UALink interconnects target AI inference TCO

Qualcomm unveils full data center portfolio: Dragonfly C1000 250-core Oryon CPU (>5GHz, PCIe Gen7, CXL), HBC near-memory compute (133TB/s Gen1, 18x-54x effective BW), AI300 inference accelerator (UALink/ESUN scale-up), and 800G/1.6T connectivity. Multi-year Meta CPU deal. Commercial sampling 2027-2028. Targets inference TCO with tokens-per-watt leadership.

NVIDIA Other 2026-06-01

NVIDIA FOX Blueprint Shifts Factory Control from PLCs to AI Agents on DGX

NVIDIA unveiled the Factory Operations Blueprint (FOX), a reference design for autonomous factory manager agents using NemoClaw, AI-Q Blueprint, and DGX Station (GB300 with 20 PFLOPS FP4, 748GB coherent memory). It unifies live machine signals, quality systems, and robot fleets under an AI decision layer. Foxconn, Pegatron, Advantech, and Wistron are early adopters, projecting 80% faster root cause analysis and 15% labor productivity gains.

NVIDIA Other 2026-06-01

NVIDIA Locks Taiwan Supply Chain with AI Factory Stack, Vera Rubin Production Tied to Proprietary Software

NVIDIA partners with TSMC, Foxconn, and others to embed its proprietary AI software (cuLitho, Omniverse, Isaac) into semiconductor manufacturing and server assembly, while ramping Vera Rubin NVL72 production. The move uses efficiency gains (e.g., 20-50% cycle time reduction) as bait to lock the supply chain into a full-stack ecosystem, increasing switching costs for partners.