Reports
AI-generated structured vendor updates
Qualcomm Dragonfly: 250-core CPU, HBC memory, UALink interconnects target AI inference TCO
Qualcomm unveils full data center portfolio: Dragonfly C1000 250-core Oryon CPU (>5GHz, PCIe Gen7, CXL), HBC near-memory compute (133TB/s Gen1, 18x-54x effective BW), AI300 inference accelerator (UALink/ESUN scale-up), and 800G/1.6T connectivity. Multi-year Meta CPU deal. Commercial sampling 2027-2028. Targets inference TCO with tokens-per-watt leadership.
NVIDIA Unveils 45°C Liquid Cooling for Rubin Chips, Slashes Water Use 100%
NVIDIA announces a liquid cooling system for its Rubin GPUs running 45°C coolant (hotter than a hot tub), using dry coolers in a closed loop to cut electricity and eliminate water evaporation (100% reduction). However, chillers may still be needed in hot climates, and chip longevity impacts remain unaddressed.
NVIDIA Rubin 100% Liquid Cooling at 45°C Slashes Cooling Energy 40%
NVIDIA Rubin generation achieves 100% liquid cooling with coolant up to 45°C, eliminating fans and cold aisles. The DSX reference design uses closed-loop dry coolers, reducing cooling energy ~40% and water consumption to near zero. Rack density triples, marking a fundamental shift in AI factory cooling.
Google Open-Sources Brazos: Plug-and-Play Liquid Cooling for Air-Cooled DCs
Google introduces Brazos, a rack-mounted closed-loop liquid-to-air cooling system for existing air-cooled data centers. Supporting 60kW per rack, it is open-sourced via OCP, enabling high-density AI/HPC deployments without facility retrofits.
Cisco Launches Liquid-Cooled Network Switch, Extending Cooling Architecture to AI Infrastructure Core
Cisco has officially launched its N9000 and 8000 systems with direct-to-chip liquid cooling, extending liquid cooling from GPU servers to network switches. The product doubles bandwidth density and reduces energy consumption by nearly 70%, addressing the thermal challenges of high-power AI clusters. This move signals a shift in data center cooling architecture from component-level optimization to systemic redesign.
HPE Deepens AI Factory Partnership with NVIDIA, Unveils Full-Stack Supercomputing Solutions
At GTC 2026, HPE announced enhancements to its NVIDIA AI Computing portfolio, introducing full-stack solutions for large-scale AI factories and supercomputers. The offerings integrate compute, GPUs, networking, liquid cooling, software, and services to improve deployment efficiency and time-to-insight.
Cisco Launches G300 Chip and Systems for AI Agent-Era Data Center Networking
Cisco introduces 102.4Tbps Silicon One G300 switching chip with liquid-cooled N9000/8000 systems delivering 70% energy efficiency, 1.6T optics support, and Nexus One unified management plane upgrade.