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Reports

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Keyword: L6级集成 ×
2 Total Reports
NVIDIA Other 2026-07-25

NVIDIA Prepay $1.5B to Amkor for US 2nm/3nm/HBM4 Advanced Packaging

NVIDIA prepays $1.5B to Amkor to expand advanced packaging capacity in Arizona, covering 2nm/3nm/HBM4. This onshores AI chip packaging, complementing Wistron's system integration, to reduce reliance on Taiwan and secure supply for Vera Rubin and Blackwell Ultra.

View Details Impact: Major
NVIDIA Other 2026-07-25

NVIDIA and Wistron Launch US-Based GB300 Production, Shifting AI Manufacturing Landscape

NVIDIA partnered with Wistron to open a $700M factory in Texas, achieving L6 integration of the GB300 Grace Blackwell Ultra system. The first US-made unit contains 1.5M parts, weighs 2 tons, and costs $4M. This milestone accelerates US AI capex localization from 5% to 30%, reshaping the global AI supply chain.

View Details Impact: Major

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