Reports
AI-generated structured vendor updates
NVIDIA Denies Kyber NVL144 Delay, But 78-Layer PCB Bottleneck Exposes AI Hardware Physics Limit
NVIDIA officially denies reports of Kyber NVL144 rack delay to 2028, but SemiAnalysis revelations about a 78-layer ultra-high-density PCB midplane bottleneck and Rubin Ultra cancellation expose hard physical limits in signal integrity and manufacturing, opening a strategic window for AMD and Google.
TSMC Accelerates Glass Substrate CoWoS with Japanese and Taiwan Partners
TSMC partners with Ibiden and Innolux to develop glass substrates for next-gen CoWoS packaging. Simulation shows 16% warpage improvement, 27% resistance reduction, targeting AI chip performance and reliability amid competition from Intel and Samsung.
TSMC Reveals Glass Substrate Plan for CoWoS, Marking Packaging Inflection
TSMC publicly disclosed its glass substrate development plan for CoWoS, partnering with Ibiden and Innolux to validate feasibility. Glass substrates offer lower signal loss and higher thermal stability than organic substrates, addressing warpage and signal integrity in large AI chip packaging. Mass production is targeted for 2027-2028, directly competing with Intel's glass substrate roadmap.
TSMC Discloses Glass Substrate Pilot, Packaging Paradigm Shifts
TSMC, with Ibiden and Innolux, publicly discloses glass substrate integration into CoWoS for advanced packaging. Glass offers superior electrical and thermal properties over organic substrates, enabling larger dies and higher density. Mass production is distant; CoPoS remains near-term priority.