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Apple Other 2025-11-06

Apple Reinforces On-Device AI and Spatial Computing Developer Ecosystem Through Success Stories and Tutorials

Apple highlights Swift Student Challenge winners who built apps using SwiftUI, Core ML (on-device ML framework), and spatial computing. It also announced new tutorials for the 2026 challenge focusing on SwiftUI, spatial computing, and machine learning. This underscores Apple's ongoing investment in on-device AI, immersive experiences, and its developer toolchain.

NVIDIA Other Medium Signal 2025-10-22

NVIDIA Publishes Tutorial for Converting Lightweight LLM into Terminal AI Agent

NVIDIA released a developer tutorial guiding users to build an AI agent that understands natural language and executes Bash commands, using its open-source Nemotron Nano v2 model within roughly 200 lines of Python code. The tutorial emphasizes building from scratch and simplifying with LangGraph, focusing on safe tool calling and human-in-the-loop control.

Trend Micro Other High Signal 2025-09-08

Trend Micro Highlights Power Automate as an Enterprise Automation Security Blind Spot

Trend Micro's research report reveals that the complexity of low-code automation tools like Microsoft Power Automate is being exploited by cybercriminals to evade detection and exfiltrate data. The study highlights critical security risks from visibility gaps within automation platforms and warns of growing demand for such attack capabilities in the cybercriminal underground.

NVIDIA Other 2025-06-06

NVIDIA and SK hynix Co-Architect Next-Gen Memory for AI Factories, Locking HBM4 to Vera Rubin

NVIDIA and SK hynix announce a multi-year tech partnership to co-develop next-gen memory for Vera Rubin, RTX Spark, and Jetson Thor. Separately, SK Telecom deploys a gigawatt-scale AI cloud using the full DGX stack, targeting 2027. This elevates SK hynix from supplier to co-architect, strengthening NVIDIA's lock-in on HBM and the AI ecosystem.

OpenAI Other Medium Signal 2025-04-15

OpenAI Updates Its Frontier AI Preparedness Framework

OpenAI has released an updated version of its frontier AI safety preparedness framework, designed to systematically measure and guard against severe risks from frontier AI capabilities. The framework outlines processes from model evaluation to deployment monitoring and establishes an internal safety advisory board.

Microsoft Other Medium Signal 2025-02-27

Microsoft Launches Phi-4 SLM Series to Enhance Edge AI and Multimodal Reasoning

Microsoft introduced the Phi-4 family of small language models (SLMs), featuring the 5.6B-parameter Phi-4-multimodal capable of processing speech, vision and text. The models are now available in Azure AI Foundry, HuggingFace and NVIDIA's API Catalog with optimized edge computing capabilities.

Qualcomm Other High Signal 2024-03-12

Bosch and Qualcomm Deepen Collaboration to Consolidate ADAS and Cockpit Compute on Single SoC

Bosch and Qualcomm are expanding their strategic partnership to jointly develop production-ready ADAS solutions based on the Snapdragon Ride platform, and to consolidate cockpit and ADAS functions onto a single SoC using Snapdragon Ride Flex. This aims to provide automakers with a clear migration path from distributed to centralized compute architectures, reducing system complexity and cost.

Qualcomm Other Medium Signal 2024-03-12

Qualcomm and Snap Deepen Collaboration, Betting on XR Devices as New AI Computing Endpoints

Qualcomm and Snap's subsidiary, Specs Inc., have signed a multi-year strategic agreement to power future Specs smart glasses with Snapdragon XR platforms. The collaboration aims to establish a scalable foundation for developers to create more intelligent and private on-device AI experiences on eyewear. This move signifies an evolution of their long-term partnership from consumer AR glasses towards a platform emphasizing device-side AI agents and immersive computing.

Anthropic Other 2021-10-07

Anthropic Launches Project Glasswing: AI Model Autonomously Finds Zero-Days, Reshaping Cyber Defense

Anthropic announces Project Glasswing, partnering with AWS, Apple, Cisco, Google, Microsoft, NVIDIA, and others to use its frontier model Claude Mythos Preview for autonomous vulnerability discovery. The model found thousands of zero-days, including decades-old flaws in OpenBSD, FFmpeg, and Linux kernel. Anthropic commits $100M in usage credits, aiming to shift cybersecurity to AI-driven defense at scale.

Google Other High Signal 2020-10-11

Google Cloud Integrates MCP with Apigee and Advances Agentic Platform to Evolve Enterprise APIs for AI Agents

Google Cloud announced the general availability of Model Context Protocol (MCP) in Apigee and the advancement of its Agentic Platform, aiming to transform traditional enterprise APIs into secure, governed tools for AI agents at scale. This move integrates API governance, security layers, and AI inference infrastructure, providing core platform capabilities for enterprises shifting from API-driven to agent-driven architectures.

Trend Micro Other High Signal 2020-06-01

Trend Micro Exposes Azure DNS Design Flaw Enabling Cloud Infrastructure Takeover

Trend Micro's TrendAI™ research team disclosed a security vulnerability "by design" in the Azure cloud platform. DNS records of deleted Azure resources may persist, allowing attackers to exploit these lingering DNS names to hijack trusted endpoints and compromise dependent systems, highlighting a critical but often overlooked trust inheritance risk in cloud infrastructure.

OpenAI Other 1970-01-01

OpenAI and Anthropic Mandate Identity Verification: End of Anonymous AI Era

OpenAI and Anthropic simultaneously enforce identity verification (ID upload, 3D liveness detection). This marks the end of anonymous AI usage, shifting AI from a chat tool to a authenticated agent capable of real-world actions, setting a new industry-wide user access standard.

Intel Other 1970-01-01

Intel Lands Google TPU Package Order: Foundry Pivot Gains Traction, TSMC Still Core

Intel secured a multi-million unit order for Google TPU packaging using its EMIB-T technology, marking its largest external AI chip deal. However, analysts caution the order is primarily for packaging, not wafer fabrication, with TSMC retaining the core manufacturing role.