Reports
AI-generated structured vendor updates
英特尔与Fortinet共同开发SP6安全处理器，强化网络防火墙ASIC能力
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TSMC Hikes Advanced Node Prices 5-10%, Squeezing AI Chip Margins
TSMC informs clients of 5-10% price hikes across all advanced nodes (7nm+), affecting 74% of wafer revenue. Apple, Nvidia, AMD, and others face higher costs, potentially raising AI infrastructure prices.
NVIDIA Locks Taiwan Supply Chain with AI Factory Stack, Vera Rubin Production Tied to Proprietary Software
NVIDIA partners with TSMC, Foxconn, and others to embed its proprietary AI software (cuLitho, Omniverse, Isaac) into semiconductor manufacturing and server assembly, while ramping Vera Rubin NVL72 production. The move uses efficiency gains (e.g., 20-50% cycle time reduction) as bait to lock the supply chain into a full-stack ecosystem, increasing switching costs for partners.
SK Hynix Jumps to TSMC 3nm for HBM4E Logic Die to Counter Samsung's 4nm Lead
SK Hynix plans to use TSMC's 3nm process for the logic die in its 7th-gen HBM4E, a leap from the 12nm used in HBM4. This aims to reverse the performance gap with Samsung (which used 4nm logic in HBM4) and deliver higher bandwidth and power efficiency for next-gen AI chips like NVIDIA's Vera Rubin Ultra.