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Samsung Electronics Other Medium Signal 2026-03-01

Samsung Unveils Agent Architecture NOS and Edge AI Server Solution

Samsung launched CognitiV NOS with agent architecture as unified decision layer for autonomous multi-agent collaboration in network lifecycle management. Also introduced in-server networking edge AI solution integrating network functions into single server for local AI processing.

Microsoft Other Medium Signal 2026-02-28

Microsoft Launches Medical Document Automation Solution on Azure AI

Microsoft leverages its existing Azure AI stack to build an industry-specific solution automating clinical documentation processing. This represents an application of existing AI capabilities rather than a new product launch.

Microsoft Other High Signal 2026-02-28

Microsoft Launches Unified AI Platform for Telecom, Integrating Azure AI with Telecom Cloud

Microsoft introduced a unified AI platform for telecom at MWC 2026, integrating generative AI, operational technology, and communication technology. The platform emphasizes trust and unification, deeply integrating Azure AI services, security capabilities, and telecom cloud products to optimize network operations and customer experience.

Apple Other Medium Signal 2026-02-27

Apple Expands US AI Server Manufacturing and Mac Production Lines

Apple relocates Mac mini production to Houston for the first time and expands AI server manufacturing, producing core components like logic boards locally. It also invests in an advanced manufacturing center to provide technical training for US manufacturing skills enhancement.

Cisco Other High Signal 2026-02-26

Cisco Partners with NVIDIA and VAST on End-to-End Secure AI Data Platform Architecture

Cisco partnered with NVIDIA and VAST to deliver a deployable AI data platform reference architecture integrating compute infrastructure, data platform, and security layers. The architecture employs Cilium for K8s networking, Tetragon for runtime security, and AI Defense for application protection, enabling full lifecycle security from data to AI applications.

Meta Other High Signal 2026-02-24

Meta and AMD Form 6GW AI Infrastructure Strategic Partnership

Meta announced a multi-year strategic partnership with AMD to deploy up to 6GW of AMD Instinct GPU computing capacity. The collaboration involves multi-generational integration of AMD GPUs, EPYC CPUs, and jointly developed Helios rack architecture, supporting Meta's diversified computing strategy. First deployments are scheduled for late 2026.

Samsung Electronics Other Medium Signal 2026-02-22

Samsung Expands Galaxy AI Multi-Agent Ecosystem with Perplexity Integration

Samsung integrates Perplexity as a new AI agent in Galaxy devices, enabling seamless multi-app collaboration through system-level coordination architecture. The solution uses voice activation and framework-level connectivity to reduce manual switching and improve multi-step workflow efficiency.

OpenAI Other Medium Signal 2026-02-13

OpenAI builds real-time access system for Sora and Codex continuous access

OpenAI developed a real-time access control system combining rate limits, usage tracking and credit mechanisms to enable stable continuous access for AI services like Sora and Codex, demonstrating technical evolution at the AI infrastructure level.

OpenAI Other Medium Signal 2026-02-09

OpenAI Tests Ads in ChatGPT for Monetization

OpenAI is testing ad placements in ChatGPT to sustain free access while maintaining answer independence, clear labeling and privacy protections. This marks a pivotal exploration in generative AI service monetization.

Microsoft Other 2025-05-07

Microsoft partners with FFA, showcasing smart sensors and AI as an edge computing case in agricultural education

Microsoft partnered with FFA to launch the "Ag Tech Challenge," providing students with a kit containing smart sensors, Azure IoT Hub, and Azure AI services to collect and analyze farm data. The project aims to apply AI and IoT technologies to agricultural education scenarios.

Samsung Electronics Other 1970-01-01

SK Hynix HBM4E Samples: 3nm Logic, 384GB/GPU, Igniting AI Memory Bandwidth Arms Race

SK Hynix has sampled its 12-layer HBM4E, featuring TSMC 3nm logic die and enhanced per-pin bandwidth, targeting Nvidia Rubin Ultra with 384GB per GPU. This marks the start of a sprint with Samsung in next-gen AI memory, where HBM BOM share has surged to 65-70%.