Filter

×
Active Filters Clear All
Keyword: 芯片 ×
127 Total Reports
2/7 Page
NVIDIA Partnership High Signal 2026-05-02

NVIDIA and Intel Announce $5 Billion Strategic Partnership: New AI Chip Supply Chain Landscape

NVIDIA and Intel announced a $5 billion strategic partnership on September 18, 2025: NVIDIA invests $5 billion for ~4% Intel stake, while Intel customizes x86 CPUs for NVIDIA AI infrastructure and x86 SoCs integrating RTX GPU chiplets for PC products. Through NVLink, the two companies form a coalition of 'AI Computing + NVIDIA CUDA + x86 Ecosystem'. This reshapes the AI chip supply chain landscape with far-reaching implications for AMD and independent chip designers.

Apple Partnership High Signal 2026-04-27

Apple-Google Multi-Year Partnership Confirmed: Gemini to Power New Siri

Apple and Google confirm multi-year partnership with Google Cloud as preferred provider. Google is building a custom 1.2 trillion parameter Gemini model for Apple, 8x Apple's current cloud model. Siri will gain Gemini capabilities in 2026 with iOS 27. Privacy architecture unchanged—Gemini runs on Apple-controlled servers with data protection guarantees. Device compatibility limits exclude hundreds of millions of older iPhone users.

Meta Partnership High Signal 2026-04-24

Meta Partners with AWS on Graviton

Meta partners with AWS to deploy tens of millions of Graviton5 cores, becoming one of the largest Graviton customers globally.

Google Product Launch 2026-04-22

Google TPU v8 Launches: Single Cluster Breaks 40 ExaFLOPS

Google launches TPU v8 chip with 40+ ExaFLOPS single cluster capacity, supporting millions of concurrent agents, 3x compute density and 2x energy efficiency improvement.

OpenAI Financial News High Signal 2026-04-19

Cerebras Launches IPO with $20B OpenAI Deal

AI chipmaker Cerebras filed for US IPO on Nasdaq with ticker CBRS; secured $20B multi-year deal with OpenAI to deploy 750MW of chips.

TSMC Financial News High Signal 2026-04-16

TSMC 2026 Outlook: AI Demand Drives 30%+ Revenue Growth, Advanced Process and Packaging Dual Constraints

Behind TSMC's revenue growth forecast is dual logic of 'volume and price both rising': AI chip demand drives shipment growth, advanced process scarcity pushes wafer unit prices up. But A16 process delay is a signal worth watching—even TSMC faces increasing difficulty in advanced process mass production.

TSMC Financial News High Signal 2026-04-16

TSMC Q1 Earnings: Advanced Packaging Capacity Bottleneck to Persist, Constraining AI Chip Supply Through 2025

TSMC Q1 earnings show HPC crossing 60% revenue share for the first time; CoWoS advanced packaging capacity will remain tight through 2027—the real AI chip supply bottleneck is packaging, not processes.

NVIDIA Financial News High Signal 2026-04-15

NVIDIA GPU Rental Prices Surge 48% in 2 Months

NVIDIA Blackwell GPU rental reaches $4.08/hour, up 48% in 2 months. Chinese cloud vendors follow with price hikes, Zhipu API up 83% in Q1.

NVIDIA Product Launch High Signal 2026-04-15

NVIDIA Rubin Era: 1.8kW GPU TDP and Mandatory Liquid Cooling Reshape Data Centers

NVIDIA's mandatory liquid cooling is a landmark event in AI infrastructure 'qualitative change' of physical form. When chip power exceeds 1.8kW, air cooling physical limits are breached, the entire data center industry chain—from power architecture, cooling systems to building structure—must be redesigned. This isn't technology upgrade but paradigm shift.

Intel Partnership High Signal 2026-04-14

Intel to Build xAI Terafab AI Chip Factory

Intel announced helping build Elon Musk Terafab AI chip factory, marking key customer breakthrough for Intel Foundry. AI chip manufacturing demand grows, foundry competition accelerates.

Meta Partnership High Signal 2026-04-14

Meta Partners with Arm on Custom Data Center Chips

Meta partners with Arm to develop custom CPUs for data centers and large-scale AI deployment. Arm and Meta launched 136-core AGI CPU, chip self-reliance wave expands from cloud vendors to full-stack players.

Meta Other High Signal 2026-04-14

Meta-Broadcom Multi-Year 2nm AI Chip Partnership, Initial 1GW+ Deployment

Meta and Broadcom announced multi-year, multi-generation strategic partnership to co-develop MTIA (Meta Training and Inference Accelerator) chips through 2029. Initial deployment exceeds 1GW, with multi-gigawatt expansion planned. Industry-first 2nm AI compute accelerator, based on Broadcom XPU platform. Meta has planned MTIA 300/400/450/500 iterations for recommendation, ranking, and large-scale inference. Broadcom CEO Hock Tan to step down from Meta board, transition to strategic advisor.

Amazon Financial News High Signal 2026-04-13

AWS AI Annual Revenue Exceeds $15B, Self-developed Chips Double to $20B

Amazon CEO Andy Jassy disclosed AWS AI service scale for the first time, accounting for about 10% of AWS $142B annualized revenue. Self-developed chips (Graviton, Trainium, Nitro) annualized revenue exceeded $20B (doubled QoQ); 2026 capex expected at $200B; analysts predict AWS could reach $600B annual sales.

Intel Technology Update High Signal 2026-04-07

Intel Foundry Breakthrough: EMIB Packaging Gains Strategic Endorsement from Google, Amazon

The strategic significance of this deal far exceeds surface numbers. Google's and Amazon's simultaneous shift to Intel signals: US cloud giants' strategic consensus on 'de-TSMC-ization' in AI chips has formed. Not just chip manufacturing, but advanced packaging—high-value-added manufacturing—is also undergoing supply chain restructuring.

ARM Other High Signal 2026-04-01

ARM Launches AGI CPU Silicon, Extends AI Infrastructure Reach

ARM debuts its first self-designed AGI CPU silicon, moving beyond IP licensing to offer full-stack solutions from custom silicon to integrated platforms. This shift redefines control points in AI infrastructure supply chains, enabling enterprises to optimize AI workload deployment at hardware layer.

ARM Other 2026-03-31

Arm Partners with Malaysian University to Cultivate Semiconductor Talent for AI Era

Arm announced a collaboration with Monash University Malaysia's School of Engineering, donating IC design development boards and establishing a guest lecturer program. The initiative aims to provide students with hands-on experience in AI chip design based on Arm architecture, addressing the growing demand for advanced computing talent in the APAC region.

Intel Other Medium Signal 2026-03-26

Intel and CrowdStrike Deepen AI PC Security Integration for Enhanced Endpoint Threat Detection

Intel and CrowdStrike expanded collaboration to deeply integrate Falcon platform with Intel AI PC hardware, leveraging CPU/GPU/NPU on-device AI acceleration and chip-level telemetry. The solution aims to enable real-time threat detection and intrusion prevention without performance loss, addressing generative AI data leakage risks at enterprise scale.

ARM Other High Signal 2026-03-25

Arm Launches Data Center Silicon Product Entering Server Hardware Market

Arm launched its first data center silicon product, Arm AGI CPU, featuring a 1OU dual-node reference server design. This marks Arm's strategic shift from IP licensing to providing complete server hardware reference designs, aimed at building the chip foundation for agent AI cloud.

Meta Other High Signal 2026-03-25

Meta and Arm Collaborate on AI-Optimized Data Center CPU

Meta partners with Arm to develop Arm AGI CPU optimized for AI workloads, targeting higher performance density and energy efficiency. As lead partner, Meta will open-source hardware designs via OCP and integrate with its proprietary MTIA chips.

ARM Other High Signal 2026-03-25

ARM Launches AGI CPU Silicon for AI Infrastructure Market

ARM introduced its first production AGI CPU silicon in March 2026, marking a strategic shift from IP licensing to full silicon solutions provider. Designed for next-gen AI infrastructure, this move may reshape the data center processor ecosystem.