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Meta Other 2026-06-29

谷歌算力告急限制Gemini使用,Meta内部AI项目推进受阻

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Google Other 2026-06-29

谷歌算力告急,开始限制Meta对Gemini大模型的使用

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Hewlett Packard Enterprise Other 2026-06-29

惠普与OpenAI达成战略合作,全面部署Frontier平台

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Ericsson Other 2026-06-29

爱立信深耕AI与6G双向发力,助力运营商决胜下一个十年

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Huawei Other 2026-06-29

华为发布GigaUplink大上行解决方案,助力运营商构建Mobile AI基础网

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Huawei Other 2026-06-29

华为Mate 90系列确认9月发布:首发麒麟9050 Pro+鸿蒙7正面对决iPhone 18 Pro

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Anthropic Other 2026-06-29

Anthropic最强模型Fable 5即将解禁,特朗普政府放宽AI出口管制

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TSMC Other 2026-06-29

华邦电子加入台积电WoW先进封装内存供应链,打破三大DRAM厂垄断

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Samsung Electronics Other 2026-06-29

三星宣布2655万亿韩元本土投资计划,重点布局半导体与AI

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NVIDIA Other 2026-06-29

英伟达加码太空算力,为Space-1系统招募首席软件架构师

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NVIDIA Other 2026-06-29

阿里前副总裁贾扬清离职英伟达,开源承诺分歧成导火索

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Research Other 2026-06-29

CVE-2026-7261:PHP SoapServer组件Use-After-Free高危漏洞预警

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Samsung Electronics Other 2026-06-29

三星电子与SK海力士联合宣布1000万亿韩元芯片投资计划,剑指AI算力霸权

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OpenAI Other 2026-06-26

OpenAI and Broadcom Tape Out First Inference ASIC Jalapeño in 9 Months, Targeting NVIDIA Dominance

OpenAI and Broadcom unveil Jalapeño, their first custom inference ASIC, fabricated on TSMC 3nm and optimized for Transformer models. Targeting a 50% inference cost reduction, it taped out in 9 months and is slated for deployment in gigawatt-scale data centers by late 2026, marking OpenAI's strategic pivot to full-stack AI infrastructure and a direct challenge to NVIDIA's inference hegemony.

Qualcomm Other 2026-06-26

Qualcomm Acquires Modular for $3.9B, Open-Sources Mojo to Break CUDA Lock-In

Qualcomm acquires Modular for $3.9B in stock and open-sources Mojo, a Python-compatible systems language. Mojo targets CUDA dependency, aiming to provide a high-performance alternative for AI developers. This move strengthens Qualcomm's AI inference chip software stack and edge AI competitiveness.

NVIDIA Other 2026-06-26

NVIDIA Rubin Mandates 100% Liquid Cooling with 45°C Warm Water, Reshaping Data Center Thermal Design

NVIDIA reveals Rubin platform's full liquid cooling design: 100% liquid, 45°C warm water inlet, eliminating chillers and fans. Mass production starts H2 2026, with a mandate for all data centers to transition to liquid cooling, marking a definitive shift in AI thermal management.

Microsoft Azure Other 2026-06-25

Microsoft Cuts Azure China R&D: Geopolitics Forces AI Cloud Retreat

Microsoft is cutting 200-400 Azure R&D roles in Beijing and Shanghai, with departures by July 2026. US AI chip export controls and China's data security laws make frontier AI development impossible. Azure China, operated via 21Vianet, has <5% market share vs Alibaba (30%) and Huawei (19%).

Qualcomm Other 2026-06-25

Qualcomm Enters AI Datacenter with Dragonfly ARM CPU, Meta Signs Multi-Generation Deal

Qualcomm unveils Dragonfly C1000 ARM-based datacenter CPU, AI300 accelerator, and interconnect. Meta commits to multi-generation CPU supply, Microsoft Azure to deploy HBC chips. Qualcomm targets $15B+ datacenter revenue by FY2029, acquires Modular for software stack.

OpenAI Other 2026-06-25

OpenAI and Broadcom unveil Jalapeño inference ASIC to bypass NVIDIA GPU dependency

OpenAI and Broadcom launch Jalapeño, a custom ASIC for LLM inference, achieving tape-out in 9 months. OpenAI designs architecture, Broadcom provides networking, Celestica handles integration. Planned for large-scale deployment by end-2026 with gigawatt-scale datacenters, aiming to cut inference costs and reduce NVIDIA dependency.

NVIDIA Other 2026-06-25

NVIDIA Unveils Vera CPU for AI Agents, Shifting Control from x86 to Proprietary Silicon

At the annual meeting, Huang announced Vera CPU for AI agents paired with Rubin GPU, claimed Blackwell delivers 30x token throughput over next-best platform, and reiterated CUDA as a moat. This move aims to shift AI compute control from general-purpose CPUs to NVIDIA's proprietary architecture.